Fully automatic high-speed screen printing machine for 8 and 12 inches wafer with image recognition device

• It accommodates both 8 inches and 12 inches wafer.
• It accommodates mask frame size of 750mm×750mm.
• Because of non-contact type wafer position correction, there is no damage to the wafers.
• It can print CSP bumps of Φ0.05mm with the world’s highest class accuracy in repetitive printing positioning (±0.003mm or less　when image recognition is used).
• Because of simple operation and simple structure, high skill level is not required for the operator.
• Operator friendly "Windows XP" is used as the OS, and the language can be selected from Japanese, English and Chinese.
• By using the rotary squeegee, deterioration and the consumption amount of solder can be suppressed. It contributes to manufacturing of high-quality products and also to the cost reduction.

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