High-spec Solder Ball Placer
Quality stabilization and high productivity by the Dual Table Transfer System
20 sec/pcs *At the dual table transfer - size 240mm x 80 mm
Each process at the PCB type Dual are correspond one stencil (flux stencil / ball stencil 1 pcs on each)
Adaptive Materials | |
---|---|
Stencil Size (X)x(Y) |
1) 650 x 750 mm 2) 650 x 550mm |
PCB Size (X)x(Y) |
Dual: 1) 50 x 60 - 360 x 140mm 2) 50 x 60 - 300 x 100 mm Single: 1) 50 x 60 - 360 x 370 mm 2) 50 x 60 - 360 x 170mm, φ300mm Thickness: 0.1 - 2.5 mm |
Performance | |
Productivity | PCB: type Dual 20sec/pcs type Single 40sec/pcs Wafer: 8 inch 90sec/pcs, 12 inch 115sec/pcs *Except inspection time. |
Print positioning repeatability accuracy | ±0.02mm |
Specification | |
Power supply utility | Single phase 200 - 240 v Frequency 50/60 Hz |
Used air utility | 0.49MPa : 200NL/Min |
Direction of setting work | Left -> Right |
Distribution line | From floor 900±20mm |
UI language | Japanese/English/Chinese/Korean |
Machine Weight | Approx. 1800kg |
Printing Direction | Rear -> Front |
Vision FOV | About 5.4 x 4.1mm |
Software operating system | Windows 7 Pro |
Lay-out | W 2860 x D 1810 x H 1680 mm *Except Tower/Monitor |
Option | |
PCB Loader by Cassettes Warpage Correction Unit PCB Cleaner Auto flux supply and rolling function Inspection machine for the ball placement - MK-BP5000I Ionizer |
MINAMI Co., Ltd. headquater ;38-32, 5-chome, Minami-cho, Fuchu-shi, Tokyo, Japan
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