38-32, 5-chome, Minami-cho, Fuchu-shi, Tokyo, Japan
MINAMI Co., Ltd. headquater
MINAMI Co., Ltd. headquater
PLA-400
Laser reflow PLA-400
Features
- Low Thermal Stress Bonding
Localized heating only for die area(Substrate / Wafer) with well-defined beam shaping laser - Less Warpage Bonding (Substrate / Wafer)
Less thermal budget/ stress (Bump type : < 1 sec, Die : < 2 sec) - High Productivity Bonding
Quick solder melting : < 1 sec laser emission Flexible beam/shot options : 30~85 mm (single/global shot) - Space saving
Compact size: Approximately 1.5m (conventional reflow furnace size: Approximately 5m) - Low running cost
N2 unnecessary
| Specification | |
|---|---|
| UPH | 24,000ea (PCB Size: 240*77.4mm / 138 unit on PCB / Global 3 Shot) *UPH depends # of dies or PKG per shot |
| Stage temp. | Max 150℃ (±5℃) *Pre-Heating |
| Laser power | 500 ~ 4,000W |
| Laser warranty | ・5 years on laser source ・2 years on laser system |
| Homogenizer beam size | □30mm ~ 85mm (Programmable) |
| Substrates | ・Single: L : 100~330mm / W : 62~330mm / Up to 12 inch wafer ・Dual: L : 100~330mm / W : Max 110mm |
| Index | ・Substrate : Shuttle, etc. ・Wafer : Clean robot. |
| Optional item | |
| ・Beam Profiler ・Power Meter ・IR Camera ・Warpage Control System |
|
External View
MINAMI Co., Ltd. headquater ;38-32, 5-chome, Minami-cho, Fuchu-shi, Tokyo, Japan
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