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Pressure (pressurized print) system【Pattented】
This is a technology originally developed by Minami whereby the solder paste contacts closely with the PCB/substrate.
Air bags are inflated within a completely sealed chamber. The pressurized printing brings the following effects.
■Improved adhesion between the work and the paste
- Because the pressure is applied before start of the mask separation, adhesion between the work and the paste is improved.
- A high quality printing (mask separation) can be realized even in the case of a high aspect ratio mask where the paste has difficulty entering inside the mask opening.
■Effect of pushing the paste out of the mask.
■Flexibility of paste design
It allows the use of low viscosity fluid, such as the dilatant fluid, in addition to the non-Bingham fluid which has been the main stream of conventional paste for screen printing.
- Pressurized type omission system version mechanism
- Please refer to the animation of the pressurized printing system for the details.
- Comparison of printing result (mask thickness: 150um)
You can see that pressurizing results in improved stability of printing even in the case of a paste which could hardly be transferred without pressure or a work not suitable for uniform printing.
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