- Notification related to petition to start civil rehabilitation proceedings(PDF:49KB)
- Exhibited at 12th IC PACKAGING TECHNOLOGY EXPO 2011 >>Exhibitors list
- MK-BP2000, a solder ball placing machine with a built-in high precision general purpose screen printer, is newly introduced.
- MKR-VC, a vacuum cure oven, is newly introduced.
- MK-888SV MA, which enables batch printing on multiple substrates, is introduced.
- The lecture titled "The story of a venture company executive" given at The University of Electro-Communications is introduced.
- The seminar at "2008 JPCA Show, The 38th International Electronic Circuits Exhibition" is introduced.
- Exhibited at "2008 JPCA Show, The 38th International Electronic Circuits Exhibition".
- Participated in "SEMICON JAPAN 2007" held on 05 - 07 December 2007.
- Obtained the ISO9001 certification for EMS Tsukuba factory
- Participated in "2007 JPCA Show The 37th International Electronic Circuits Exhibition".
MK-888SV High precision, general-purpose screen printer
This is a high precision, fully automatic screen printer with image recognition device. The adoption of sealed type rotary squeegee head and the pressurizing type stencil separation system enables printing of narrow pitch solder bumps.
MK-1208 Custom-made screen printer for 12 inch wafer
This is a printer for 12 inch / 8 inch wafer.
It corresponds to the FOUP cassette by the options.
MK-BP2000 Solder ball placing machine with a built-in high precision general purpose screen printer
This is a solder ball placing machine which automatically accomplishes solder ball placing onto wafers or substrates. Because the solder ball placing head scatters the solder balls without touching them by air curtain method, stable solder ball supply is accomplished without damaging or deforming the solder balls.
MKR-1200 Vacuum reflow furnace with plasma irradiation
This reflow furnace corresponded to both sizes of 12 inch and 8 inch wafers.
It is a 6 zone type rotary reflow furnace.
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Minami is providing EMS subcontracting services. We can respond to the requirements for experimental prototype making, short turn-around-time prototype making and volume production - To the details of EMS subcontracting service >>
- LED mixed resin filling technology 【Patented】
- Introduction of a technology which enables high-speed and high-quality filling by stirring and supplying mixed paste of fluorescent material and resin.
To the details of LED mixed resin filling technology >> - Solder bump printing onto WLCSP（Wafer level CSP） 【Patented】
- Introduction of package processing technology of wafer level CSP based on screen printing.
To the details of solder bump printing >> - Void-less reflow 【Patented】
- Introduction of a technology for eliminating the voids generated during the solder bump formation with the help of a special vacuum method.
To the details of void-less reflow>> - Ball placer
- Original ball supply method by which solder balls are not damaged. 100% inspection of all transferred solder balls. Introduction of a technology which enables reliable ball placing using a special stencil.
To the details of ball placer >> - Multi Alignment
- Introduction of a technology by which simultaneous printing on multiple substrates is accomplished by a multiple substrates simultaneous positioning vision system.
To the details of Multi Alignment >> - Two stage solder thickness 【Patented】
- Introduction of a technology which enables printing of 2 stage solder thicknesses for micro components and standard components
To the details of two stage solder thickness >> - Rotary squeegee 【Patented】
- Introduction of a sealed type solder paste printing squeegee.
To the details of rotary squeegee >> - Pressurized printing system 【Patented】
- Introduction of a pressurizing type stencil separation printing system.
To the details of pressurized printing system >>
- Screen Printer
- SMT Printer