38-32, 5-chome, Minami-cho, Fuchu-shi, Tokyo, Japan
MINAMI Co., Ltd. headquater
MINAMI Co., Ltd. headquater
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Solder bump printing onto WLCSP（Wafer level CSP）【Pattented】
Introduction of a package processing technology where solder bumps are printed on wafer level CSP
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Void-less Reflow【Pattented】
Introduction of a technology which reduces the voids generated by heating and cooling
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Ball Placer
A unique ball supply method, which does not damage the solder balls, is employed. Accuracy and tact time are substantially improved by the new round shaped ball placing head.
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Multi Alignment
Introduction of a technology by which simultaneous printing on multiple substrates is accomplished by a multiple substrates simultaneous positioning vision system.
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Two stage solder thickness【Pattented】
Introduction of a technology whereby the solder paste is printed in two staged thickness for micro size parts and standard size parts
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Rotary Squeegee【Pattented】
Introduction of a sealed type squeegee for solder paste printing
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Pressurized printing system【Pattented】
Introduction of a pressurized printing system for improved mask separation
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