Introduction of a technology to fill fluorescent mixed paste in high speed and high quality by supplying the paste while mixing the fluorescent and the resin which have different specific gravity.
Introduction of a package processing technology where solder bumps are printed on wafer level CSP
Introduction of a technology which reduces the voids generated by heating and cooling
A unique ball supply method, which does not damage the solder balls, is employed. Accuracy and tact time are substantially improved by the new round shaped ball placing head.
Introduction of a technology by which simultaneous printing on multiple substrates is accomplished by a multiple substrates simultaneous positioning vision system.
Introduction of a technology whereby the solder paste is printed in two staged thickness for micro size parts and standard size parts
Introduction of a sealed type squeegee for solder paste printing
Introduction of a pressurized printing system for improved mask separation
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